The packaging industry is undergoing a transformative shift driven by advancements in testing technologies. Rodger Segelstrom ...

Historically, these packaging systems were developed by manufacturers after stages of unregulated trial and testing. However, it wasn’t until 2008 that the US Food and Drug Administration (FDA ...

At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). Wafer fabrication consists of creating ...

Co-packaged optics require hybrid testing systems with reliable alignment techniques that can handle both electrical and optical signals simultaneously.

Brussels-based paper and board manufacturers’ organization releases 16-page update to its recyclability methodology parameters.

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TAIPEI (Reuters) - ASE Technology Holding Co., the world's largest chip packaging and testing provider, said on Thursday it expects its revenue from leading-edge advanced packaging and testing to ...

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX) today officially launched its fifth plant in Penang, Malaysia. The new plant ...