The packaging industry is undergoing a transformative shift driven by advancements in testing technologies. Rodger Segelstrom ...

At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). Wafer fabrication consists of creating ...

Testing should aim to gather feedback through interviews, observation and questionnaires in order to identify errors, suggest further enhancements and comment on performance.

Co-packaged optics require hybrid testing systems with reliable alignment techniques that can handle both electrical and optical signals simultaneously.

Brussels-based paper and board manufacturers’ organization releases 16-page update to its recyclability methodology ...

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TAIPEI, Feb 13 (Reuters) - ASE Technology Holding Co.(3711.TW), opens new tab, the world's largest chip packaging and testing provider, said on Thursday it expects its revenue from leading-edge ...

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX) today officially launched its fifth plant in Penang, Malaysia. The new plant ...

TAIPEI (Reuters) - ASE Technology Holding Co., the world's largest chip packaging and testing provider, said on Thursday it expects its revenue from leading-edge advanced packaging and testing to ...