The packaging industry is undergoing a transformative shift driven by advancements in testing technologies. Rodger Segelstrom ...

At its core, semiconductor manufacturing involves two main stages: front-end processes, (wafer fabrication) and back-end processes (packaging and test). Wafer fabrication consists of creating ...

Co-packaged optics require hybrid testing systems with reliable alignment techniques that can handle both electrical and optical signals simultaneously.

Brussels-based paper and board manufacturers’ organization releases 16-page update to its recyclability methodology ...

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TAIPEI (Reuters) - ASE Technology Holding Co., the world's largest chip packaging and testing provider, said on Thursday it expects its revenue from leading-edge advanced packaging and testing to ...

Advanced Semiconductor Engineering, Inc. (ASE, a member of ASE Technology Holding Co., Ltd. TAIEX: 3711, NYSE: ASX) today officially launched its fifth plant in Penang, Malaysia. The new plant ...

TAIPEI, Feb 13 (Reuters) - ASE Technology Holding Co.(3711.TW), opens new tab, the world's largest chip packaging and testing provider, said on Thursday it expects its revenue from leading-edge ...